Design and Simulation of High SNR Varying Thickness Embedded Strain Sensing Polymer Microcantilever for BioSensing Applications
Date of Submission
28th Jan 2025
General Information:
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Year Of Paper Submission : 2018-19 |
Type of Applicant : Faculty |
Selected Course : UG |
Department of Applicant : COMPS |
Class of Applicant : Faculty |
Applicants Details:
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Applicant Name : P. V. Kasambe |
Applicant No. 2 Name : K. S. Bhole |
Guide Details:
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Paper Details:
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Title of Paper : Design and Simulation of High SNR Varying Thickness Embedded Strain Sensing Polymer Microcantilever for BioSensing Applications |
Type of Paper : Conference |
Type of Publication : International |
Date Of Conference / Journal / Book :
2000-01-01 |
Conference_Type : IEEE |
Address of Host Institute : Quebec City, Canada |
DOI : 10.1115/DETC2018-85731 |